Boron-Implanted Termination Structures for Vertical GaN Power Devices with Highly Enhanced Breakdown Voltage
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- Miura Yoshinao
- AIST Advanced Power Electronics Research Center
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- Hirai Hirohisa
- AIST Advanced Power Electronics Research Center
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- Nakajima Akira
- AIST Advanced Power Electronics Research Center
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- Harada Shinsuke
- AIST Advanced Power Electronics Research Center
Bibliographic Information
- Other Title
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- 硼素イオン注入終端構造を用いた縦型GaNパワー素子の高耐圧化
Abstract
<p>We propose a new edge termination technique for high-voltage vertical GaN power devices using boron-ion implantation into a p-GaN epitaxial layer. The boron-implanted layer after annealing at 800°C results in a half-conductive p-type layer that is applicable to junction termination extension (JTE). The maximum breakdown voltage of 1400 V was near an ideal value for the donor concentration in the drift layer. High avalanche current immunity was observed for the optimal structure. In wafer-scale fabrication of the p-n diodes on a 4-inch free-standing GaN substrate, good reverse characteristics are observed across the wafer. The proposed JTE technique has high potential for wafer-scale fabrication of robust and highly efficient vertical GaN devices.</p>
Journal
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- IEEJ Transactions on Electronics, Information and Systems
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IEEJ Transactions on Electronics, Information and Systems 144 (3), 251-256, 2024-03-01
The Institute of Electrical Engineers of Japan
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Keywords
Details 詳細情報について
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- CRID
- 1390299318867562752
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- ISSN
- 13488155
- 03854221
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
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- Abstract License Flag
- Disallowed