Hybrid Bonding Technology Utilizing Molding Compound and Photo Imageable Dielectric Systems

DOI Web Site 参考文献5件

抄録

<p>Currently, high-density semiconductor packages have been required to satisfy the demands of realizing high-performance computing network systems. Hybrid bonding is one of the promising processes for 3D-IC package utilizing WoW (wafer on wafer), CoW (chip on wafer) to realize fine vertical interconnection by die stacking. However, the current fabrication processes and materials for hybrid bonding are based on the front-end based technology such as dry processes and Si-based inorganic materials. In this paper, we demonstrated a novel hybrid bonding system using organic materials especially for Epoxy Molding Compound (EMC) and Photo Imageable Dielectric (PID) which are frequently applied to Fan-Out WLP (Wafer Level Package) and PLP (Panel Level Package) with CMP, UV modification and thermal annealing processes.</p>

収録刊行物

参考文献 (5)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ