オゾンファインバブル処理による硫酸銅めっき液中の有機添加物の分解
書誌事項
- タイトル別名
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- Decomposition of Organic Impurities in Copper Sulfate Plating Solution by Ozone Fine Bubble Treatment
抄録
<p>Fine bubbles（FBs）, bubbles of less than 100 μm diameter, have attracted attention in recent years. These have been applied via new technology in widely diverse fields, not only in industry, but also in agriculture and fisheries, and in our daily lives for medical and cosmetic effects. Their applications continue to expand.</p><p>For surface treatment particularly, FBs are attracting much interest for their effectiveness at cleaning, water quality improvement, surface modification, and wastewater treatment. Organic additives such as brighteners and wetting agents can be added to an electroplating solution. Moreover, the properties and functionality of a coating can be maintained when they are added in the proper ratio. In such cases, activated carbon treatment is performed to adjust the organic additives' concentration. However, because activated carbon treatment is time-consuming, it is often performed on holidays when the production line is stopped, which places heavy burdens on workers.</p><p>As described herein, we applied FB instead of activated carbon treatment to a copper sulfate plating solution, and thereby confirmed that ozone FB treatment is applicable for decomposing organic additives.</p>
収録刊行物
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- 表面技術
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表面技術 75 (5), 231-235, 2024-05-01
一般社団法人 表面技術協会
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詳細情報 詳細情報について
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- CRID
- 1390300069820849536
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- ISSN
- 18843409
- 09151869
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
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- 抄録ライセンスフラグ
- 使用不可