SiC device process technology
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- KIMOTO Tsunenobu
- Department of Electronic Science and Engineering, Kyoto University
Bibliographic Information
- Other Title
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- SiCプロセス技術
- 基礎講座 基礎編 パワーエレクトロニクスの基礎(4)SiCプロセス技術
- キソ コウザ キソヘン パワーエレクトロニクス ノ キソ 4 SiC プロセス ギジュツ
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Abstract
<p>The process technology of SiC, a wide bandgap semiconductor suited for high-voltage and low-loss power devices, is reviewed.To fabricate SiC-based devices, novel process technology is required such as high-temperature annealing.Fundamental issues in ion implantation, dry etching, an oxidation process for forming a metal-oxide-semiconductor interface, and Schottky and ohmic contacts of SiC are described.</p>
Journal
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- Oyo Buturi
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Oyo Buturi 74 (3), 371-375, 2005-03-10
The Japan Society of Applied Physics
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Keywords
Details 詳細情報について
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- CRID
- 1390564227308925312
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- NII Article ID
- 10014489791
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- NII Book ID
- AN00026679
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- ISSN
- 21882290
- 03698009
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- NDL BIB ID
- 7269143
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- CiNii Articles
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- Abstract License Flag
- Disallowed