Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
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- Imakiire Akihiro
- Department of Electronics and Engineering, Kyushu Institute of Technology
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- Kozako Masahiro
- Department of Electronics and Engineering, Kyushu Institute of Technology
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- Hikita Masayuki
- Department of Electronics and Engineering, Kyushu Institute of Technology
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- Tatsumi Kohei
- IPS Research Center, Waseda University
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- Inagaki Masakazu
- IPS Research Center, Waseda University
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- Iizuka Tomonori
- IPS Research Center, Waseda University
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- Sato Nobuaki
- Mitsui High-tec Inc.
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- Shimizu Koji
- Mitsui High-tec Inc.
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- Ueda Kazutoshi
- Mitsui High-tec Inc.
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- Sugiura Kazuhiko
- DENSO CORPORATION
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- Tsuruta Kazuhiro
- DENSO CORPORATION
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- Toda Keiji
- TOYOTA MOTOR CORPORATION
Bibliographic Information
- Other Title
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- Niメッキ接合を用いたSiCパワーモジュールの熱抵抗と過渡熱解析
- Ni メッキ セツゴウ オ モチイタ SiC パワーモジュール ノ ネツ テイコウ ト カト ネツ カイセキ
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Abstract
<p>This paper deals with the thermal resistance and thermal conduction characteristics of a Nickel Micro Plating Bonding (NMPB) power module in comparison with those of a power module adapting a conventional structure with a high-temperature solder attachment. An attempt is made to estimate the thermal resistance and thermal structure function for the two types of power modules when peeling of the chip junction occurs. In terms of spreading heat, an NMPB is superior to a conventional power module using high temperature solder, because NMPB allows spreading heat from both sides of the chip and setting the heat spreader near the chip.</p>
Journal
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- IEEJ Transactions on Industry Applications
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IEEJ Transactions on Industry Applications 139 (10), 838-846, 2019-10-01
The Institute of Electrical Engineers of Japan
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Keywords
Details
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- CRID
- 1390564227317595520
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- NII Article ID
- 130007722402
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- NII Book ID
- AN10012320
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- ISSN
- 13488163
- 09136339
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- NDL BIB ID
- 030010313
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed