Solderability Using Thermoset Resin-Based Solder Pastes Covered with Thermoplastic Resin Film

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<p>We developed novel bonding materials composed of thermoset epoxy resin, solder particles, and thermoplastic polyester resin film. The resistor chip component was bonded to the substrate using the thermoset resin-based solder pastes covered with the thermoplastic polyester resin film. The thermoplastic resin film can hold the thermoset resins having high fluidity on the substrate. The molten solder particles became coalesced and wetted on the electrodes during the heating process, resulting in the formation of a conductive path covered with the cured resin. The polyester resin film softened with increasing temperature, and the softening is assisted by the epoxy resin acting as a plasticizer for the thermoplastic resin. It was suggested that the epoxy resin mixed spontaneously with the polyester resin at elevated temperatures and did not prevent the molten solder particles from wetting on the electrode of the chip component. The viscosity of the thermoset resins increased during storage even at 298 K owing to the curing reaction and/or moisture absorption, which affected the solderability.</p>

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  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 59 (8), 1359-1366, 2018-08-01

    公益社団法人 日本金属学会

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