159 Development of Real-Time Monitoring Technology of Strain in 3D Electronic Packaging Systems

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  • ISOBE Koki
    Department of Finemechanics, Graduate School of Engineering, Tohoku University
  • SUZUKI Ken
    Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
  • MIURA Hideo
    Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University

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  • 159 三次元実装半導体システム内ひずみの実時間モニタリング技術の開発

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