Prevention of chip adhesion by acting non-ionic surfactant physical properties

DOI Web Site

Bibliographic Information

Other Title
  • 非イオン系界面活性剤の物性による切りくず付着の抑制
  • ヒイオンケイ カイメン カッセイザイ ノ ブッセイ ニ ヨル キリクズフチャク ノ ヨクセイ

Search this article

Description

In the hole drilling process, chips remaining inside the drilled hole can easily adhere to the tool. To prevent chip adhesion, an electroplated diamond tool with a hemispherical edge and two plain clearances for discharging cutting chips at the cylindrical part has been developed. Using this tool, chip adhesion on the tool can be reduced as the cutting chips are efficiently discharged during the hole drilling process. However, as the number of drilling process increases, a small amount of remaining cutting chips begin to adhere to the chip discharge area, which influences the chip discharge performance. This study was performed to investigate the properties of surfactant contained in machining fluid used in the hole drilling process and their influence on chip adhesion.

Journal

Keywords

Details 詳細情報について

Report a problem

Back to top