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- SATAKE Urara
- Osaka University
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- ENOMOTO Toshiyuki
- Osaka University
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- OGAWA Takahiro
- Osaka University
Bibliographic Information
- Other Title
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- エッジ・ロールオフ抑制に有効な研磨パッドの選定方法
Abstract
<p>As the substrates of semiconductor devices, silicon wafers are required to have extremely high surface flatness for increasing the integration density of the devices. Edge roll-off, which deteriorates the surface flatness near the wafer edge in polishing process as the final stage of the wafer manufacturing, is strongly demanded to be suppressed. Hardness is thought to be one of the most important specifications of polishing pads for estimating the obtained edge roll-off, and then compressibility of polishing pads is widely evaluated in practical process. However, it has not been clarified whether the obtained edge surface flatness can be estimated by the conventional hardness tests of polishing pads. In this study, we investigated the evaluation method of deformation property of polishing pads for estimating the obtained edge roll-off. Polishing experiments on silicon wafers confirmed that the obtained edge surface flatness was able to be estimated by the proposed evaluation method of deformation property of polishing pads.</p>
Journal
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- The Proceedings of Mechanical Engineering Congress, Japan
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The Proceedings of Mechanical Engineering Congress, Japan 2018 (0), S1330004-, 2018
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390564238093229952
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- NII Article ID
- 130007620163
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- ISSN
- 24242667
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed