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- Shinoda Takuya
- JEITA
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- Miyazaki Ken
- JEITA IDAJ
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- Kumano Yutaka
- JEITA
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- Yasutake Ippei
- JEITA
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- Suzuki Hiroko
- JEITA
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- Nishi Koji
- JEITA
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- Tsujimura Toshihiro
- JEITA
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- Eto Jun
- JEITA
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- Miyoshi Toshihiro
- JEITA PIDE
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- Takizawa Noboru
- JEITA
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- Yuan Qun
- JEITA
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- Hirasawa Koichi
- JEITA KOA
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- Tachibana Junichi
- JEITA
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- Yoshida Toshifumi
- JEITA
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- Umeda Takaaki
- JEITA
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- Endo Fumitake
- JEITA
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- Shinohara Keiichi
- JEITA
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- Hatori Kimihito
- JEITA
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- Sugama Chie
- JEITA
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- Hori Keichi
- JEITA
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- Ookasaki Akihiko
- JEITA
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- Sakurai Ikuo
- JEITA
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- Tsumori Masaru
- JEITA
Bibliographic Information
- Other Title
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- 高精度な詳細半導体パッケージ熱モデル
Abstract
<p>Regarding semiconductor package models used for thermal analysis of electronic devices. For example, the DELPHI model is specified in JEDEC JESD15-4, but the detailed model has no standard. Therefore, model abstraction depends on the manufacture of the semiconductor device you are creating. Users using it cannot compare and validate their models under the same conditions. On the other hand, semiconductor device manufacturers need to hide as much as possible internal structures and materials that are competing fields. In this research, in order to solve this subject, the parameter that influences a thermal-analysis result was specified, and the highly precise JTAM model (JEITA Thermally Accurate Model) was developed by the minimum input. This improves the distribution of thermal analysis models and creates an environment where users can easily compare parts.</p>
Journal
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- The Proceedings of the Thermal Engineering Conference
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The Proceedings of the Thermal Engineering Conference 2019 (0), 0017-, 2019
The Japan Society of Mechanical Engineers
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Details 詳細情報について
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- CRID
- 1390566775130039040
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- NII Article ID
- 130007835943
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- ISSN
- 2424290X
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed