分子動力学法を用いた銅二結晶構造粒界強度の結晶方位依存性評価

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  • 范 怡晴
    東北大学 大学院工学研究科ファインメカニクス専攻
  • 鈴木 研
    東北大学 大学院工学研究科先端材料強度科学研究センター
  • 三浦 英生
    東北大学 大学院工学研究科先端材料強度科学研究センター

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  • Molecular Dynamics Analysis of the Effect of Crystallographic Orientation on the Strength of a Grain Boundary in a Bicrystal Structure of Copper

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<p>Polycrystalline materials in nano-scale have been found to show the drastic variation of both mechanical and electrical properties strongly depending on the quality of grain boundaries. As for the electroplated copper thin-film interconnections applied to the semiconductor devices, the reliability of the fine interconnections should vary depending on the order of the atom arrangement around grain boundaries. In this research, in order to clarify the effect of the mismatch in the crystallographic orientation between two grains, of which a grain boundary inbetween is consisted, on the strength of the grain boundary, molecular dynamics analysis was applied to the deformation analysis of the bi-crystal structures with various combinations of crystallographic orientations. It was found that the effective strength and fracture mode of bicrystal structures varied drastically depending on the combination of the crystallographic orientations of the two grains in the bicrystal structures.</p>

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