Fabrication of sensors and MEMS by room-temperature bonding using gold thin films

HIGURASHI Eiji, MATSUMAE Takashi, KURASHIMA Yuichi, TAKAGI Hideki

doi:10.11470/oubutsu.90.10_623

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Other Title

金薄膜を用いた常温接合によるセンサ・MEMS作製
キンハクマクオモチイタジョウオンセツゴウニヨルセンサ・ MEMS サクセイ

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Description

<p>In recent years, room-temperature or low-temperature bonding technologies have attracted considerable attention and have become increasingly important for realizing high-performance multifunctional semiconductor devices featuring small sizes, low power consumption, high thermal dissipation, and high output power, among other properties. Sensors and microelectromechanical systems (MEMS) are typically made of Si and various non-Si materials, including glass, polymers, and piezoelectric materials, and require wafer-level hermetic packaging with small cavity volumes. Therefore, room-temperature or low-temperature bonding technologies with advanced features, such as low thermal damage and low residual stress due to the mismatch of the thermal expansion coefficients of dissimilar materials, are rapidly becoming popular for the fabrication of sensors and MEMS. This study focuses on surface activated bonding (SAB) using Au thin films for room-temperature bonding and introduces some recent research topics on hermetic and vacuum sealing of sensors and MEMS. It is expected that such technology can be used to fabricate gas cells for miniaturized atomic clocks.</p>

Journal

Oyo Buturi

Oyo Buturi 90 (10), 623-627, 2021-10-05

The Japan Society of Applied Physics