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- SUGIKI Akio
- 大分デバイステクノロジー株式会社
Bibliographic Information
- Other Title
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- ワイドギャップ半導体向けパワーモジュール技術開発
Abstract
<p> High heat resistance, low inductance, and low thermal resistance are required for power module packages that bring out the performance of wide-gap semiconductors. This paper reports the results of developing a power module for wide-gap semiconductors.</p>
Journal
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- Journal of the Japan Society of Applied Electromagnetics and Mechanics
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Journal of the Japan Society of Applied Electromagnetics and Mechanics 30 (1), 2-8, 2022
The Japan Society of Applied Electromagnetics and Mechanics
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Details 詳細情報について
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- CRID
- 1390573407639812224
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- ISSN
- 21879257
- 09194452
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- Text Lang
- en
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- Data Source
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- JaLC
- Crossref
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- Abstract License Flag
- Disallowed