Effect of dummy patterns on Si wafer for InP/Si direct bonding toward hybrid photonic devices on Si-platform through CMOS process
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- Mitarai Takuya
- Tokyo Tech.
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- Inamura Miki
- Ayumi Ind.
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- Abe Tomoyuki
- Ayumi Ind.
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- Morita Kenji
- Tokyo Tech.
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- Amemiya Tomohiro
- Tokyo Tech. FIRST
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- Nishiyama Nobuhiko
- Tokyo Tech. FIRST
Bibliographic Information
- Other Title
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- CMOSプロセス加工Siプラットフォーム上ハイブリッド光デバイスに向けたInP/Si直接接合へのSi側ダミーパターンの影響
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2019.2 (0), 1234-1234, 2019-09-04
The Japan Society of Applied Physics
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Keywords
Details 詳細情報について
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- CRID
- 1390574290237576576
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC