Study of cryo-packaging for Josephson voltage standard chip using supersonic solder
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- Maruyama Michitaka
- AIST
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- Yamamori Hirotake
- AIST
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- Shimazaki Takeshi
- AIST
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- Amagai Yasutaka
- AIST
Bibliographic Information
- Other Title
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- 超音波半田を用いたジョセフソン電圧標準用素子実装の検討
Journal
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- JSAP Annual Meetings Extended Abstracts
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JSAP Annual Meetings Extended Abstracts 2018.2 (0), 2273-2273, 2018-09-05
The Japan Society of Applied Physics
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Details 詳細情報について
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- CRID
- 1390574909314720384
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- ISSN
- 24367613
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- Text Lang
- ja
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- Data Source
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- JaLC