Proposal for Improving Design Efficiency by utilizing MBD in cooperation with Tier 1 and Tier 2
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- Aruga Yoshinori
- KOA(株)
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- Mukaiyama Daisaku
- ルビコン(株)
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- Ueda Masanari
- シーメンスEDA ジャパン(株)
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- Shinoda Takuya
- (株)デンソー
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- Taoka Naoto
- (株)IDAJ
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- Takei Haruki
- シーメンス(株)
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- Takizawa Noboru
- 元ローム(株)
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- Egami Takao
- 東芝デバイス&ストレージ(株)
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- Arimoto Shiho
- 日立Astemo(株)
Bibliographic Information
- Other Title
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- Tier1, Tier2 MBD連携による設計の効率化
- - Modeling of Passive Components Compatible with VHDL-AMS and Utilization of the Model -
- － VHDL-AMS対応受動部品モデルと活用 －
Abstract
In-vehicle electrical equipment is becoming smaller and more sophisticated. For the thermal design of these devices, it is important to consider not only the semiconductors, which are the main heat source, but also the passive components (resistors, capacitors, etc.) used in the peripheral circuits. In this paper, we propose a passive component model compatible with VHDL-AMS, which has been widely used for multi-domain analysis of circuits and heat. We explain the issues and the taken measures in modeling chip components, and discuss the analysis results using the model.
Journal
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- Transactions of Society of Automotive Engineers of Japan
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Transactions of Society of Automotive Engineers of Japan 53 (6), 1140-1145, 2022
Society of Automotive Engineers of Japan
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Details 詳細情報について
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- CRID
- 1390575185895554560
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- ISSN
- 18830811
- 02878321
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- Text Lang
- ja
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- Data Source
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- JaLC
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- Abstract License Flag
- Disallowed