Effect of Surface Treatment in Au/Ni/ n-GaN Schottky Contacts Formed on Cleaved m-Plane Surfaces of Free-Standing n-GaN Substrates
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- SHIOJIMA Kenji
- Graduate School of Electrical and Electronics Engineering, Faculty of Engineering, University of Fukui
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- IMABAYASHI Hiroki
- Graduate School of Electrical and Electronics Engineering, Faculty of Engineering, University of Fukui
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- MISHIMA Tomoyoshi
- Research Centre for Micro-Nano Technology, Hosei University
Bibliographic Information
- Other Title
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- へき開した自立n-GaN基板の<i>m</i>面に形成したAu/Niショットキー接触における表面処理の影響
Abstract
<p>We fabricated and characterized Au/Ni Schottky contacts on cleaved m-plane free-standing n-GaN surfaces (i) without any surface treatment, (ii) with H2O2 treatment, or (iii) with HCl treatment by current-voltage (I-V), capacitance-voltage (C-V), and photoresponse (PR) measurements. 50-nm-thick Ni films and 50-nm-thick Au films were deposited in turn on the m-plane surface by electron-beam evaporation to form Schottky contacts. All of the Schottky contacts were circular and 100µm in diameter. The highest step determined by the laser microscope was 5 nm, but in some dots, steps were not observed. The as-cleaved samples showed I-V characteristics with small n-values and less diode-to-diode variation. However, the H2O2 samples had much smaller Schottky barrier height (qϕB). Whereas the HCl samples exhibited significantly large diode-to-diode variation. The qϕB and n-values obtained from the I-V, C-V, and PR results are nearly constant, independent of the step height. This is probably because the steps also consist of m-plane facets, which have no effect on the electrical characteristics of the Schottky diodes. It is confirmed that cleaving without any surface treatment can provide a cleaner surface to form Schottky diodes on m-plane n-GaN surfaces than that with conventional HCl treatment.</p>
Journal
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- Journal of the Society of Materials Science, Japan
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Journal of the Society of Materials Science, Japan 71 (10), 819-823, 2022-10-15
The Society of Materials Science, Japan
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Details 詳細情報について
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- CRID
- 1390575285352290816
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- ISSN
- 18807488
- 05145163
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- KAKEN
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- Abstract License Flag
- Disallowed