Novel Temporary Bonding/Debonding System Enabling Advanced Packaging Process
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- Enomoto Tetsuya
- Organic Materials Research Department, Advanced Technology Research & Development Center, Research & Innovation Promotion Headquarters, Showa Denko Materials Co., Ltd.
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- Miyazawa Emi
- Organic Materials Research Department, Advanced Technology Research & Development Center, Research & Innovation Promotion Headquarters, Showa Denko Materials Co., Ltd.
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- Akasu Yuta
- Organic Materials Research Department, Advanced Technology Research & Development Center, Research & Innovation Promotion Headquarters, Showa Denko Materials Co., Ltd.
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- Sobue Shogo
- Packaging Materials Research & Development Department, Information & Communication Research & Development Center, Information & Communication Business Headquarters, Showa Denko Materials Co., Ltd.
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- Nakamura Yuki
- Packaging Materials Research & Development Department, Information & Communication Research & Development Center, Information & Communication Business Headquarters, Showa Denko Materials Co., Ltd.
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- Kawamori Takashi
- Organic Materials Research Department, Advanced Technology Research & Development Center, Research & Innovation Promotion Headquarters, Showa Denko Materials Co., Ltd.
書誌事項
- 公開日
- 2022-12-16
- DOI
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- 10.2494/photopolymer.35.153
- 公開者
- フォトポリマー学会
この論文をさがす
説明
<p>Novel temporary bonding/debonding system including high heat resistant temporary bonding adhesive and debonding methods with conventional laser ablation or newly developed photonic release by Xe flash light irradiation will be introduced. Our new temporary bonding adhesive shows no delamination and no voiding after thermal treatment over 300 ℃ and can be easily removed by peeling off after debonding from the support carrier. In addition, by adopting the dual layer structure with adhesive layer and laser release layer, we can form the suitable structure for debonding with laser ablation. Furthermore, in the case that metal layer is applied instead of laser release layer, debonding by one-shot Xe flash light irradiation within 5 ms can be achieved, indicating the increased throughput at debonding process as compared to the other dobonding methods. Process demonstration results of wafer thinning down to 50 μm, fan-out wafer level packaging (FOWLP) will also be shown in this paper.</p>
収録刊行物
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- Journal of Photopolymer Science and Technology
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Journal of Photopolymer Science and Technology 35 (2), 153-159, 2022-12-16
フォトポリマー学会
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詳細情報 詳細情報について
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- CRID
- 1390576889053564800
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- ISSN
- 13496336
- 09149244
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- Crossref
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- 抄録ライセンスフラグ
- 使用不可