Development of Stretchable Thermosetting Resin Film for Pliable Electronic Circuit Material

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  • 伸縮性を有する熱硬化性樹脂フィルムの開発

Abstract

<p>Wearable device products are evolving into devices in which people wear electronics like clothing-type devices.Pliable electronic circuit material with low rigidity and elasticity are required for the devices that have excellent wearing comfortableness and high affinity. This paper introduces the characteristics required for pliable electronic circuit material and gives multiple examples of the development of material based on not only urethane resin and silicone resin known as soft resin materials, but also acrylic resin and epoxy resin. In particular, we introduce an example of development that achieved both the characteristics of conventional resins and stretchability by applying a slide-ring polymer to the chemical crosslinking site of epoxy resin, which is widely used as a circuit board material. In addition, we also introduce examples of the application of various resin-based materials to devices.</p>

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