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A Low-Profile, Scalable 28-GHz Phased Array Antenna in Fan-Out Wafer Level Package for 5G Communication
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- Naoki Oshima
- NEC Corp.
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- Shinichi Hori
- NEC Corp.
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- Jian Pang
- Tokyo Inst. of Tech.
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- Atsushi Shirane
- Tokyo Inst. of Tech.
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- Kenichi Okada
- Tokyo Inst. of Tech.
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- Kazuaki Kunihiro
- NEC Corp.
Description
This paper presents a 4-element (2×2) dual- polarized 28-GHz phased array antenna in package (AiP) for 5G communication. The AiP utilizes advanced fan-out wafer-level package (FOWLP) technology embedding a 65-nm CMOS beamformer IC and yields a low profile of 0.47 mm. Despite such an extremely low profile, a practical bandwidth of 2 GHz (27-29 GHz) is achieved by slot-fed antenna design. The antenna element on the AiP exhibits an EIRP of 15.2 dBm with good uniformity due to high fabrication accuracy of FOWLP. The AiPs are designed to be scalable so that they can be arranged in two dimensions to make a larger-scaled array. A 16-elements (2×8) phased array module using the four AiPs exhibits a peak EIRP of 40.5 dBm and is capable of scanning within ±40° close to ideal beam patterns, indicating high scalability of the developed FOWLP-based AiP.
Journal
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- IEICE Proceeding Series
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IEICE Proceeding Series 73 359-361, 2022-11-29
The Institute of Electronics, Information and Communication Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1390577376031467520
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- ISSN
- 21885079
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- Text Lang
- en
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- Data Source
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- JaLC
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- Abstract License Flag
- Disallowed