Comparison of Dislocation Accumulation Behavior upon Thermal Cycling in Ti–30Ni–20Cu and Ti–39Ni–11Pd Shape Memory Alloys

DOI Web Site Web Site 参考文献22件
  • Heima Akira
    School of Materials and Chemical Technology, Tokyo Institute of Technology
  • Shinohara Yuri
    Department of Mechanical and Intelligent Systems Engineering, The University of Electro-Communications
  • Inamura Tomonari
    Laboratory for Materials and Structures, Institute of Innovative Research, Tokyo Institute of Technology

この論文をさがす

説明

<p>Accumulation behavior of transformation-induced dislocation upon thermal cycling of Ti–30Ni–20Cu which satisfies the triplet condition (TC) was compared to that of Ti–39Ni–11Pd which is known as low hysteresis shape memory alloy designed by the condition that the middle eigenvalue of lattice deformation is 1 (CC1). The dislocation density was determined by the Williamson-Hall method. Although the 0.2% proof stress of the Ti–30Ni–20Cu alloy was about half that of the Ti–39Ni–11Pd alloy, the dislocation accumulation behavior was almost the same in both alloys. The formation of transformation-induced dislocation is effectively suppressed by satisfying TC, more than equivalently to satisfying CC1 only. TC is suggested to be a new guideline to design durable shape memory alloy.</p>

収録刊行物

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 65 (3), 352-355, 2024-03-01

    公益社団法人 日本金属学会

参考文献 (22)*注記

もっと見る

関連プロジェクト

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ