書誌事項
- タイトル別名
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- Active bending device arranging SMA wires to prevent surface overheating
説明
<p>A tool to control the bending of a laser fiber protruding from the endoscope tip using shape memory alloy(SMA) wire that shrinks when heated by Joule heat was developed. In the conventional bending device, the SMA wire that is driven during bending contacts the outer tube that covers the device and overheats the surface of the device. For the prevention of surface overheating, a link part was added to the center of the device that restricts the movement of the driven SMA wires. The bending device with a center link was fabricated and measured the bending angle and surface temperature. The device with a center link realized a larger bending angle and lower surface temperature comparing the conventional structure.</p>
収録刊行物
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- 年次大会
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年次大会 2023 (0), J162p-03-, 2023
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390581070827235328
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- ISSN
- 24242667
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
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- 抄録ライセンスフラグ
- 使用不可