書誌事項
- タイトル別名
-
- Fabrication of Low Resistive and Adhesive Cu Layer on Glass Substrate by Chemical Bath Deposition and Chemical Reduction
- カガク ヨウエキ セキシュツホウ ト カガク カンゲン ニ ヨル ガラス キバン ジョウ エ ノ テイテイコウ ・ ミッチャクセイ Cuソウ ノ ケイセイ
この論文をさがす
説明
<p>The surface state of soda-lime glasses before and after ultrasonication pretreatments with water, acetone, ethanol, water/ethanol/NaOH solutions, and UV/O3 treatment were estimated using atomic force microscopy（AFM）and Fourier-transformed infrared spectroscopy with attenuated total reflection mode（FT-IR-ATR）. Ultrasonication with water/ethanol/NaOH solutions and UV/O3 treatments drastically decreased the size and number of surface contaminant particles and enhanced absorption of the isolated silanol and hydrogen-terminated silanol. The Cu（OH）2/Cu（O,S）bilayers were prepared using chemical bath deposition（CBD）in aqueous solutions containing copper（II）nitrate hydrate, ammonium nitrate, and urea or thiourea on glass substrates treated with water/ethanol/NaOH solutions. Top metallic Cu layers were then formed chemically by simple immersion of the bilayers into a NaBH4 aqueous solution. The sheet resistance decreased with increasing immersion time, leading to 0.68 Ω/□ sheet resistance and 3.3×10−5 Ω cm resistivity after 10 min immersion. The adhesion strength was estimated using the tape peeling off test with a tensile testing machine and adhesion tape. The Cu/Cu（OH）2/Cu（O,S）bilayer fabricated by chemical reduction for 10 min exhibited maximum and average adhesion strengths of 13.3 N/cm and 11.0 N/cm, respectively. The adhesivity was inferred to have originated from hydrogen bonding between the oxygen ions in Cu（O,S）and -OH- in silanol of the glass substrate.</p>
収録刊行物
-
- 表面技術
-
表面技術 75 (9), 408-414, 2024-09-01
一般社団法人 表面技術協会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390582850003070976
-
- NII書誌ID
- AN1005202X
-
- ISSN
- 18843409
- 09151869
-
- HANDLE
- 10935/0002006135
-
- NDL書誌ID
- 033713556
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- IRDB
- NDLサーチ
- Crossref
-
- 抄録ライセンスフラグ
- 使用不可
