A hybrid interface design based on chip edge connection and inductively coupling connection for 3D stacked chips

DOI Web Site 参考文献28件
  • Yang Zhuo
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Cui Yang
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Xiong Jie
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Zheng Pan
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Gao Hao
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Cai Wenwen
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Lv Hui
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”
  • Zhang Li
    Hubei University of Technology National “111 Research Center for Microeletronics and Integrated Circuits”

書誌事項

公開日
2024-12-25
DOI
  • 10.1587/elex.21.20240577
公開者
一般社団法人 電子情報通信学会

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説明

<p>Conventional three-dimensional packaging chips are based the through-silicon via (TSV) technology. Compared with TSV, inductively coupled interconnect (ICI) ensures reduced costs and increased flexibility. However, some limitations of ICI include high transmission delays and wire-bonding costs. Moreover, it requires the determination of the chip ID during testing. To address these issues, an automatic chip-ID-determining (Auto ID) circuit was combined with a chip edge connect (CEC) technology based on the inter-integrated circuit (IIC) protocol. The experimental results revealed that the CEC technology generated conductive channels at the chip edge, and the Auto ID circuit obtained the chip ID without additional processes. The transmission delay of IIC was one-sixth that of ICI when data were transmitted across 16-layer chips.</p>

収録刊行物

  • IEICE Electronics Express

    IEICE Electronics Express 21 (24), 20240577-20240577, 2024-12-25

    一般社団法人 電子情報通信学会

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