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CoWoS, Advanced Packaging Technologies Enabling the AI-Era
Bibliographic Information
- Other Title
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- AI時代を牽引する実装技術，現状と課題
- AI ジダイ オ ケンイン スル ジッソウ ギジュツ,ゲンジョウ ト カダイ
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Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 28 (1), 28-36, 2025-01-01
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390584176921263616
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- NII Book ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 033925769
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL Search
- Crossref
