RF Performance Comparison Before and After Flip-Chip Packaging of 60 GHz Band Si-CMOS Transmitter RF-IC Module

DOI

Bibliographic Information

Other Title
  • 60 GHz 帯 Si-CMOS 送信 RF-IC モジュールのフリップチップ実装前後における RF 特性比較

Abstract

We compared RF performance of 60 GHz band Si-CMOS transmitter RF-IC module. At first we measured on-wafer characteristics of the transmitter module, then the module was measured after flip-chip mounted on organic resin substrate with underfill sealing.

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Keywords

Details 詳細情報について

  • CRID
    1390845712979498112
  • NII Article ID
    130007428845
  • DOI
    10.11486/ejisso.27.0_127
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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