The reason which needs a three-dimensional format (fo SiP design)

DOI

Bibliographic Information

Other Title
  • SiPにおける3次元フォーマットの必要性

Abstract

A device embedded substrates and SiP (System In Package) prosper. Although it is each company technology competition stage still more,in order for this technology to spread, there is a hurdle which mustbe exceeded partly. Three-dimension data is especially inevitable, and a device andpreparation are needed also for near CAD/CAM and equipment to utilize. Although that serves as a key is circulating electronic data, in theformat which is circulating now, information runs short greatly. This announcement describes the necessity for a three-dimensionalformat, and the present progress.

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Keywords

Details 詳細情報について

  • CRID
    1390845712980418176
  • NII Article ID
    130007428680
  • DOI
    10.11486/ejisso.27.0_31
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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