Digital Image Correlation Measuring of Strain and Stress Distributionon Mixed Adhesive Joints Bonded by Honeymoon Adhesion Using TwoTypes of Second-Generation Acrylic Adhesives of Two Components

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  • KAWASAKI Shota
    Department of Mechano-Micro Engineering, Tokyo Institute ofTechnology
  • SEKIGUCHI Yu
    Institute of Innovative Research, Tokyo Institute of Technology
  • NAKAJIMA Gosuke
    Electronic Materials Research Department, Shibukawa Plant,Denka Company Limited
  • HARAGA Kosuke
    HARAGA Adhesion Technology Consulting Co., Ltd.
  • SATO Chiaki
    Institute of Innovative Research, Tokyo Institute of Technology

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  • 第二世代アクリル系接着剤を用いて製作した接着層塗り分け継手のひずみ及び応力分布の評価

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Abstract

<p>For stress relief in the adhesive layer, various methods have been proposed, including the use of scarf joints.However, these techniques are highly dependent on the adherend thickness and are thus of limited use. Thestress concentration of the joints can be relaxed by using mixed adhesive joints (MAJs), which employ a brittleadhesive in the middle portion of the overlap and a ductile adhesive at the bondline ends. In a previous paper,we proposed a manufacturing method of adhesive joints that have a variable modulus adhesive layer. Whenusing the proposed method, adhesive flow has a significant effect on the adhesive layer property distribution.Considering adhesive flow using finite element analysis or numerical analysis is difficult. Therefore, anexperimental evaluation is necessary to elucidate the actual behaviors of these joint types.The principal aim of this study was to investigate the relationship between applied patterns of brittle andflexible adhesives and the stress distributions of those adhesive layers. Accordingly, stress distributions ofsingle lap joints were evaluated by a tensile test using a digital image correlation (DIC) method. Based on theDIC results, MAJs contributed to the relaxation of the adhesive layer stress concentration. According to theresults of the adherend strain distribution, the longer was the soft type of adhesive, the wider was the stressconcentration area.</p>

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