3P1-8 Mechanical property of ultrasonic bonded FPCB/RPCB joint with self-assembling material(Poster Session)

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Bibliographic Information

Other Title
  • 3P1-8 自己集合材を用いた超音波溶接FPCB/RPCB接合の機械特性(ポスターセッション)

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Description

As the demand for thin, light and multi-functional devices increased, the ultrasonic bonding methods has spot-lighted to novel bonding method. We evaluated the mechanical property of ultrasonic bonded joints with various conditions using self-assembling material which was Sn-58Bi solder particles dispersed in epoxy resin. After bonding process, we evaluated the mechanical and electrical properties between electrodes. The peel strength of the joints was increased with increasing of bonding time, and the resistance was decreased with increasing of bonding time.

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Details 詳細情報について

  • CRID
    1390845713023294592
  • NII Article ID
    110009847183
  • DOI
    10.24492/use.34.0_427
  • ISSN
    24331910
    13488236
  • Text Lang
    en
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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