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Thermal stability improvement of sintered Ag materials by addition of tungsten compound particles
Bibliographic Information
- Other Title
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- タングステン化合物粒子添加によるAg焼結接合材料の熱安定性の向上
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 31 (0), 178-179, 2017
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390845713047845504
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- NII Article ID
- 130007585095
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles