SJI(Solder-Joint-Inspection) 30 years and issues to be solved based on 3D technology
Bibliographic Information
- Other Title
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- SJI(Solder-Joint-Inspection)30年と3D化で解決すること
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 31 (0), 70-73, 2017
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390845713048344576
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- NII Article ID
- 130007584864
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles