An example of short failure between terminals in BGA with underfill material
Bibliographic Information
- Other Title
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- アンダーフィルで封止したBGAの端子間短絡故障
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 31 (0), 46-48, 2017
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390845713048863744
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- NII Article ID
- 130007583586
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- Text Lang
- ja
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- Data Source
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- JaLC
- CiNii Articles