Development of an Evaluation Method of the Strength of a Grain in Polycrystalline Copper Thin Films Based on the Order of Atom Arrangement

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  • LUO Yifan
    Department of Finemechanics, Graduate School of Engineering, Tohoku University
  • SUZUKI Ken
    Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University
  • MIURA Hideo
    Fracture and Reliability Research Institute, Graduate School of Engineering, Tohoku University

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Other Title
  • 原子配列の秩序性に基づく銅薄膜結晶強度評価技術の開発

Abstract

<p>In this study, a highly-reliable evaluation method of the strength of a grain in polycrystalline copper thin films was developed to establish a relationship between the crystallinity and the effective strength of a grain and a grain boundary by combining EBSD (Electron Backscattered Diffraction) analysis and micro tensile test system. The crystallinity of a grain or a grain boundary was quantitatively expressed as IQ (Image Quality) value obtained from the EBSD analysis. And the strength of a grain in polycrystalline copper thin films was evaluated by using the developed micro tensile test. Finally, the obtained results indicated that the critical resolved shear stress of this microstructure significantly changed with the IQ value of the grain boundary.</p>

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