Wafer defect detection method based on machine vision

DOI
  • Zhao Chundong
    College of Electronic Information and Automation, Tianjin University of Science and Technology
  • Chen Xiaoyan
    College of Electronic Information and Automation, Tianjin University of Science and Technology
  • Zhang Dongyang
    College of Electronic Information and Automation, Tianjin University of Science and Technology
  • Chen Jianyong
    College of Electronic Information and Automation, Tianjin University of Science and Technology
  • Zhu Kuifeng
    College of Electronic Information and Automation, Tianjin University of Science and Technology
  • Su Yanjie
    College of Electronic Information and Automation, Tianjin University of Science and Technology

説明

With the development of integrated electronic circuit manufacturing technology, enterprises have put forward higher requirements for the quality of silicon chips. Aiming at the low efficiency of silicon wafer defect detection, this paper proposes an automatic defect detection method based on machine vision. The voiding algorithm based on flood fill can effectively extract the inner contour information of the wafer profile. A rotation correction algorithm is proposed to correct the wafer yaw angle. The actual wafer was used to verify the performance of the proposed method. The results show that the proposed method is effective in detection accuracy.

収録刊行物

キーワード

詳細情報 詳細情報について

  • CRID
    1390846609806741760
  • DOI
    10.5954/icarob.2020.os15-2
  • ISSN
    21887829
  • 本文言語コード
    en
  • データソース種別
    • JaLC
    • Crossref
  • 抄録ライセンスフラグ
    使用不可

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