書誌事項
- タイトル別名
-
- Industrial Application of Ultrashort Laser Processing
- Laser Review フォトニクス産業応用に向けた超短パルスレーザーマイクロプロセッシング
- Laser Review フォトニクス サンギョウ オウヨウ ニ ムケタ チョウタンパルスレーザーマイクロプロセッシング
この論文をさがす
抄録
Due to their extremely high peak intensity, ultrashort laser pulses can readily initiate the multi-photon process at the focal point inside transparent materials and directly and precisely join them via localized melting without any intermediate layer under a room-temperature environment. These features are well fi tted for the hermetic sealing of such photonics devices as solar cells, LCDs, and MEMS. We review the recent advances of the welding or joining of glass substrates with an ultrashort laser micro (ULM) joining technique. After briefl y discussing its principles, we address such critical issues of it as the pulse repetition rate, the use of the fi lamentary propagation of pulses, residual stress, glass-metal joining, the joined glass-metal interface, and the temperature dynamics. Finally, we introduce trial applications to industrial solar cell panels and the glass-Si wafer joining.
収録刊行物
-
- レーザー研究
-
レーザー研究 41 (10), 780-, 2013
一般社団法人 レーザー学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390848647544206080
-
- NII論文ID
- 130007897316
-
- NII書誌ID
- AN00255326
-
- ISSN
- 13496603
- 03870200
-
- NDL書誌ID
- 024949271
-
- 本文言語コード
- ja
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可