The Critical Point of Average Grain Size in Phonon Thermal Conductivity of Fine-Grained Undoped Lead Telluride

  • Bumrungpon Mongkol
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Morioka Issei
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Yasufuku Ryusuke
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Hirai Toshiharu
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Hanasaku Kenichi
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Hirota Kenji
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Takagi Katsuhiro
    Graduate School of Advanced Technology and Sciences, Tokushima University
  • Hasezaki Kazuhiro
    Department of Mechanical Science, Graduate School of Technology, Industrial and Social Sciences, Tokushima University

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Description

<p>Undoped PbTe was melted at 1123 K, ball milled (BM) at rotation speeds from 90 to 180 rpm and hot pressed (HP) at 147 MPa and 650 K. Milling at 120 rpm produced the minimum phonon thermal conductivity of 1.29 W m−1 K−1 and average grain size of 0.80 µm. Phonon thermal conductivity was constant from coarse grain size to fine grain size of 1 µm and decreased suddenly at 0.80 µm. This tendency of phonon thermal conductivity corresponded to theoretical calculations with grain boundary scattering. However, the observed critical point of 1 µm was much larger than the calculated value of 0.03 µm. There was a significant inverse relationship between phonon thermal conductivity and FWHM of X-ray diffraction peaks. The low phonon thermal conductivity was associated with not only grain boundary scattering but high internal strain.</p>

Journal

  • MATERIALS TRANSACTIONS

    MATERIALS TRANSACTIONS 61 (10), 2025-2029, 2020-10-01

    The Japan Institute of Metals and Materials

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