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- 前田 修一
- 山口大学大学研究推進機構先進科学イノベーション研究センター
書誌事項
- タイトル別名
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- Thermal Adhesive Properties between Thermoplastic Poly(Ether-Block-Amide) Elastomers and Other Polymers
- ネツ カソセイ ポリ(エーテル-ブロック-アミド)エラストマー ト イシュ ポリマー カン ノ ネツ セッチャク トクセイ
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説明
<p>We investigated the strong thermal adhesive properties between thermoplastic polyamide elastomers (PAE) and other polymers (thermoplastic polyurethanes (TPU) and cross-linked polybutadienes (cBR)). The interfacial tensions between PAE and TPU or BR were evaluated from the dispersed particle size and rheological characteristics of slow relaxation mechanism for PAE/TPU and PAE/BR blends prepared by melt-blending. Although the values of interfacial tensions by both evaluation methods did not agree very well, it was found that the interfacial tensions of both polymer systems were considerably small. The good thermal adhesive properties between PAE and TPU or PAE and cBR are thought to be due to their low interfacial tensions and thick interfacial thickness of these polymer systems. However, in order to obtain sufficient adhesive strength for polymer systems with small interfacial tension, it is important to set molding conditions so that the interfacial thickness becomes sufficiently thick.</p>
収録刊行物
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- 日本レオロジー学会誌
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日本レオロジー学会誌 49 (2), 119-125, 2021-04-15
一般社団法人 日本レオロジー学会
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詳細情報 詳細情報について
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- CRID
- 1390851010459852160
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- NII論文ID
- 130008038514
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- NII書誌ID
- AN00198812
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- ISSN
- 21864586
- 03871533
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- NDL書誌ID
- 031440309
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDLサーチ
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