Electromigration Resistance of Electroplated Gold Thin Films Used for Fine Bumps as a Strong Function of the Crystallinity of Grain Boundaries

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  • NAKAUCHI Genta
    Dept. of Finemechanics, Grad. School of Eng., Tohoku Univ.
  • MIURA Hideo
    Fracture and Reliability Research Institute, Grad. School of Eng., Tohoku University

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  • 微細バンプ用めっき金薄膜エレクトロマイグレーション耐性の結晶粒界品質依存性

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