High Thermal Conductive and Insulating Material for the Next-Generation Power Module Using Bismaleimide / Benzoxazine Resin System

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  • ビスマレイミド／ベンゾオキサジン樹脂を用いた次世代パワーモジュール向け高放熱絶縁材料の開発

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<p>The bismaleimide resins including the mesogenic group as thermal conductive moiety have been combined with the benzoxazine resin. The resins cured at 220℃ / 90 min have exhibited higher Tg (>200℃) than the operation temperature for the next generation power device and higher thermal conductivity (λ)(0.30－0.33 W/(m・K)) than the conventional epoxy resins (approx. 0.2 W/(m・K)). Furthermore, the composite with 60 vol% of boron nitride has provided not only high thermal conductivity (18.8 W/(m・K)) and thermal resistance but also high breakdown voltage (>60 kV). Therefore, the resin system is expected to be applied to the high heat release and insulating material for the next generation power module.</p>

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