書誌事項
- タイトル別名
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- Thermal Adhesive Properties between Thermoplastic Poly(ether-block-amide) Elastomers and Polyimide Films
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説明
<p>We investigated the strong thermal adhesive properties between thermoplastic polyamide elastomers (PAE) and polyimide (PI) films. Three kinds of PI films (UPILEX ® S film, UPILEX ® RN film and Kapton® film) were used in this study. From the analysis by the Young-Düpre theory with the PI film surface observations, the surface tensions of PI films and the contact angles of PAE melts on PI films, it was found that the interfacial tension between PAE and PI film is considerably small. The excellent thermal adhesive properties between the PAE and PI films are thought to be due to the low interfacial tension between these polymers and the thick interfacial thickness. However, in order to obtain sufficient adhesive strength, it is important to set the preparation conditions so that the interface thickness formed by both polymers is sufficiently thick. The thermal adhesive mechanism of the PAE/PI film obtained in this study is similar to that between PAE and thermoplastic polyurethane or crosslinked polybutadiene.</p>
収録刊行物
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- 日本レオロジー学会誌
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日本レオロジー学会誌 50 (2), 161-170, 2022-04-15
一般社団法人 日本レオロジー学会
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詳細情報 詳細情報について
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- CRID
- 1390855035383540992
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- ISSN
- 21864586
- 03871533
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- Crossref
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- 抄録ライセンスフラグ
- 使用不可
