Erosion Resistance of Iron-Boron Nitride Composite Plating to Molten Lead-Free Solder
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- Watanabe Jun
- Industrial Engineering Department, OKI Nextech Co., Ltd.
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- Hatsuzawa Kenji
- Industrial Engineering Department, OKI Nextech Co., Ltd.
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- Ogata Shigeyuki
- Industrial Engineering Department, OKI Nextech Co., Ltd.
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- Yoshida Shinichi
- Industrial Engineering Department, OKI Nextech Co., Ltd.
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- Golberg Dmitri
- Centre for Materials Science and School of Chemistry and Physics, Queensland University of Technology (QLD) World Premier International Center for Materials Nanoarchitectonics (WPI-MANA), National Institute for Materials Science (NIMS)
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- Shohji Ikuo
- Graduate School of Engineering, Gunma University
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<p>In accordance with the EU RoHS Directive, the use of Sn–3 mass%Ag–0.5 mass%Cu lead-free solder (SAC305) has become the standard in the manufacturing of electronics. Since SAC305 contains more tin than the conventional tin-lead eutectic solder, erosion of the Fe plating frequently occurs on a hand soldering iron tip and a point soldering machine nozzle. In this study, to extend the life of the Fe plating layer, we investigated the applicability of a composite plating in which Fe is combined with the boron nitride (BN) compounds. We used BN particles as the bulk material, and boron nitride nanotubes (BNNT) as a nanomaterial, to fabricate the regarded composite materials. A solderability test and an erosion resistance test were conducted on the composite plating layer, made of both Fe-BN particles and Fe-BNNTs composites. In the solderability test, the spreading factor of SAC305 on the Fe-BN particle and on the Fe-BNNT composite platings were about the same as, or a little decreased compared to, that of the bare Fe plating. The SAC305 solder was not repelled by either composite plating. In the erosion resistance test, the Fe-BNNT composite plating performed the best, and had the lowest erosion depth. The erosion depths of the Fe-BN particle composite plating and the Fe plating ranged from about 6 to 24 times greater, respectively, than those of the Fe-BNNT composite plating layer, confirming that, in a nanomaterial BNNT-base, composite diffusion of Fe into SAC 305 can be suppressed.</p>
収録刊行物
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- MATERIALS TRANSACTIONS
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MATERIALS TRANSACTIONS 63 (8), 1112-1119, 2022-08-01
公益社団法人 日本金属学会
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詳細情報 詳細情報について
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- CRID
- 1390855809743887488
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- NII書誌ID
- AA1151294X
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- ISSN
- 13475320
- 13459678
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- NDL書誌ID
- 032298464
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
- Crossref
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- 抄録ライセンスフラグ
- 使用不可