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Sinterability and Bondability of Cu Paste Using Reductive Solvent
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- KOBATAKE Takanori
- R&D, Business Strategy, Smart SBU, DAICEL CORPORATION
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- IKEDA Banri
- R&D, Business Strategy, Smart SBU, DAICEL CORPORATION
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- ITAYA Ryo
- Sensing BU, Smart SBU, DAICEL CORPORATION
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- SUGANUMA Katsuaki
- F3D, The Institute of Scientific and Industrial Research （ISIR）, Osaka University
Bibliographic Information
- Other Title
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- 還元機能を有する溶剤を用いた銅ペーストの焼結性能および接合性能
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Description
The reductive solvents for Cu sinter paste were successfully de veloped. The solvents generate reductive gas by heating, and temperature of reducing gas’s generation from the solvents can be controlled. Designing the stability and sinterability of Cu paste can be modified by the selection of solvents. The Cu paste using reductive solvents can sinter at 180℃ for 5 min in N2 atmosphere, and the sintered body’s electrical resistivity is very low（11μΩ・cm）. The factor of sinterability is expected to be obtained by generation of Cu nano particles in Cu paste with solvents. The Cu paste using reductive solvents can be applied to bonding materials. The Cu paste can make Cu-Cu joints by void-less and crack-less sinter layer by pressure sintering process.
Journal
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- Journal of Smart Processing
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Journal of Smart Processing 11 (6), 278-283, 2022-11-10
Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)
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Details 詳細情報について
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- CRID
- 1390861150942934528
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- ISSN
- 21871337
- 2186702X
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- Text Lang
- ja
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- Data Source
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- JaLC
- Crossref
- OpenAIRE
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- Abstract License Flag
- Disallowed