Effect of Cold Plasma Voltage and Treatment Duration on the Microstructure and Hydrophilicity of Mushroom Grain Spawn
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- Fong Mun Oon
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
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- Agun Linda
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
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- Mohd Fadthul Ikmal Misnal
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
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- Muhamad Nor Firdaus Zainal
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
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- Redzuan Norizah
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
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- Norhayati Binti Ahmad
- School of Mechanical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia
Abstract
Nowadays, cold plasma treatment systems are widely used in many fields such as agriculture. It was proven that this technique can improve growth rate of mushroom grain spawn, but no research had been done on spawn treatment using cold plasma. Cold plasma surface treatment system was developed by using voltages of 2kV to 4 kV and treatment durations of 5s to 60 s were used. The results show an improvement of grain spawn hydrophilic properties and growth rate. The most suitable parameters to treat mushroom grain spawn were 2.5kV of voltage with treatment time of 15s resulting in increasing growth of mushroom until 5.7cm.
Journal
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- Evergreen
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Evergreen 11 (1), 379-385, 2024-03
Transdisciplinary Research and Education Center for Green Technologies, Kyushu University
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Details 詳細情報について
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- CRID
- 1390862776827960576
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- DOI
- 10.5109/7172300
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- ISSN
- 24325953
- 21890420
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- HANDLE
- 2324/7172300
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- Text Lang
- en
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- Data Source
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- JaLC
- IRDB
- Crossref
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- Abstract License Flag
- Allowed