Predictive Maintenance for Plasma Cleaner by Using Plasma Monitor

DOI Web Site 1 References
  • Shirouzu Hiroshi
    Semiconductor Process Development Department 2, Circuit Formation Processes Coordination Department, Process Automation Business Division, Panasonic Connect Co., Ltd.
  • Tanjo Atsufumi
    Industrial Solutions No.4, Industrial Solutions, Digital Division, IBM Japan Digital Services Company
  • Weng Zhenxiong
    Industrial Solutions No.4, Industrial Solutions, Digital Division, IBM Japan Digital Services Company
  • Tamura Koji
    Semiconductor Process Development Department 2, Circuit Formation Processes Coordination Department, Process Automation Business Division, Panasonic Connect Co., Ltd.
  • Mine Kotaro
    Semiconductor Process Development Department 2, Circuit Formation Processes Coordination Department, Process Automation Business Division, Panasonic Connect Co., Ltd.
  • Ogawa Shotaro
    Semiconductor Process Development Department 2, Circuit Formation Processes Coordination Department, Process Automation Business Division, Panasonic Connect Co., Ltd.
  • Katsuyama Chihiro
    Semiconductor Process Development Department 2, Circuit Formation Processes Coordination Department, Process Automation Business Division, Panasonic Connect Co., Ltd.

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Other Title
  • プラズマモニターを用いたプラズマクリーナーにおける予知保全

Abstract

<p>Plasma cleaners are used in the assembly process of semiconductors for the purpose of improving wire bondability and improving the adhesiveness of mold sealing resin.</p><p>Plasma cleaners produce a less volatile reaction than semiconductor front-end processes in which wafers are plasma-processed, so polymer deposition in the chamber progresses faster. Dirt in this chamber will damage the workpiece being machined.</p><p>On the other hand, from the viewpoint of preventive maintenance, it is necessary to perform maintenance according to the progress of polymer deposition in chamber, and since the degree of polymer deposition in the chamber was unknown, the timing of maintenance could not be estimated.</p><p>Therefore, we report on a method for estimating the degree of polymer deposition in the chamber using a plasma monitor that measures changes in plasma impedance with an existing sensor required for machine operation.</p>

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