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Development of compact wideband balun using multilayer substrate-integrated coaxial line
Bibliographic Information
- Other Title
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- 多層基板による基板集積同軸線路を用いた小型広帯域バランの開発
Journal
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- Proceedings of JIEP Annual Meeting
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Proceedings of JIEP Annual Meeting 38 (0), 13C3-4-, 2024
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390866345576981888
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- Text Lang
- ja
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- Data Source
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- JaLC