Cu–20 at.％ Ni–6.7 at.％ Al合金の時効にともなう組織と硬さの変化

榛木 隆太, 千星 聡, 金野 泰幸, 高杉 隆幸, 首藤 俊也, 兵藤 宏

doi:10.34562/jic.59.1_48

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タイトル別名

Microstructure and Hardness of Isothermally Aged Cu–20 at.% Ni–6.7 at.% Al Alloy
Cu-20 at.% Ni-6.7 at.% AI合金の時効にともなう組織と硬さの変化
Cu-20 at.% Ni-6.7 at.% AI ゴウキンノジコウニトモナウソシキトカタサノヘンカ

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<p>The microstructural evolution and strengthening of Cu–20 at.％ Ni–6.7 at.％ Al alloy during isothermally aging at 450 to 650℃ were investigated to understand age–induced precipitation and hardening behavior for Cu–Ni–Al system. In an initial stage of aging, fine ordered Ni₃Al particles with a size of several tens nm was coherently formed in parent grains of Cu solid solution in a continuous precipitation manner, together with cellular components composed of Cu solid solution and fine fibrous Ni₃Al phases by grain boundary reaction. During furthermore aging, fine Ni₃Al particles in grains were continuously nucleated and grown, while cellular components at grain boundaries seemed not to be developed. The alloy exhibited a maximum hardness more than 320 Hv by aging at 550 to 650℃, which was greatest among conventional copper alloys. The hardening in the alloy was principally contributed to a high–density dispersion of fine ordered Ni₃Al particles in grains. According to the time–temperature transformation （TTT） diagram for the alloy, aging at 600 to 650℃ should be effective to obtain a microstructure with fine dispersion of ordered Ni₃Al particles and without cellular components, resulting in an excellent strength with the alloy.</p>

収録刊行物

銅と銅合金

銅と銅合金 59 (1), 48-53, 2020

日本銅学会

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CRID: 1391412326423581568

NII論文ID: 130007940917

NII書誌ID: AA11995570

DOI: 10.34562/jic.59.1_48

ISSN: 2435872X; 13477234

NDL書誌ID: 030592879

Web Site: http://id.ndl.go.jp/bib/030592879; https://ndlsearch.ndl.go.jp/books/R000000004-I030592879

本文言語コード: ja

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