Electromagnetic imprint technique combined with electrophoretic deposition technique in forming microelectrode structures

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Abstract

<jats:p> In this study, we integrate the electromagnetic soft mold imprint technique with the electrophoretic deposition technique, and apply them to forming microelectrode structures. The compound casting technology is used to produce a magnetic soft mold of a microelectrode structure, which can effectively reduce the time and cost of molding. The use of an electromagnetic imprint device can apply more evenly distributed imprint pressure, thus, the microelectrode structure can be entirely imprinted onto an indium tin oxide (ITO) soft substrate, and then the electrophoretic deposition technique is employed to deposit titanium dioxide (TiO<jats:sub>2</jats:sub>) nanopowder on the ITO soft substrate of the microelectrode structure. In addition to the key techniques and processes of electromagnetic soft mold imprinting, In this study, we explore the application of electrophoretic deposition and imprinting to prove that combining these techniques to form a microelectrode structure is a simple, low-cost, high duplication, and high-speed process. It is proven a good choice for producing micro-nanocomponents. </jats:p>

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