Integration of micro-light-emitting-diode arrays and silicon driver for heterogeneous optoelectronic integrated circuit device

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  • Integration of micro light emitting diode arrays and silicon driver for heterogeneous optoelectronic integrated circuit device
  • Special issue: Solid state devices and materials
  • Special issue Solid state devices and materials

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<jats:p> In this paper, we proposed the possibility of implementing a single chip device for realizing optoelectronic integrated circuits (OEICs). Micro-light-emitting-diode (LED) arrays and a complementary metal–oxide–semiconductor (CMOS) pulse width modulation (PWM) silicon driver were proposed, designed, and fabricated on a single chip. The micro-LED arrays were separated by a dry etching method into 64 pixels of 8×8, each with a size of 30×30 µm<jats:sup>2</jats:sup> and operated in 3 V at 100 µA. The PWM Si driver was well operated and modulated using various control signals. Furthermore, to investigate the driver for handling massive parallel information, a simple multifunctional driver was designed, fabricated, and flip-chip-bonded using a gold compliant bump and anisotropic conductive adhesive with micro-LED arrays. </jats:p>

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