Identification of Elastic-Plastic-Creep Constitutive Equation for Lead-Free Solder Bump Using Shearing Test and Computational Simulation.

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  • MOMONOI Yoshinobu
    Analytical Technology Research Laboratory, Matsushita Electric Works, Ltd.
  • SETO Michio
    Analytical Technology Research Laboratory, Matsushita Electric Works, Ltd.
  • KUZUHARA Ikko
    Semiconductor Technology Research Laboratory, Matsushita Electric Works, Ltd.
  • TANAKA Kyoji
    Semiconductor Technology Research Laboratory, Matsushita Electric Works, Ltd.
  • TOMITA Yoshihiro
    Faculty of Engineering, Kobe Univ.

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Other Title
  • 鉛フリーはんだバンプのせん断試験とそのシミュレーションによる弾塑性クリープ構成則の同定
  • ナマリ フリー ハンダ バンプ ノ センダン シケン ト ソノ シミュレーション ニ ヨル ダン ソセイ クリープ コウセイソク ノ ドウテイ

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The identification of the elastic-plastic-creep constitutive equation for the lead-free solder bump is very important to design the structure of semiconductor packages. Through the shearing tests in the scanning electron microscope (SEM), it has been clarified that the displacement of the generating crack increases as the testing temperature increases. With a simplex method, an identification method of the elastic-plastic-creep constitutive parameters has been developed such that the computational results for the shear force at the specific shear deformation coincide with those obtained by experiments of bump. Very good correspondence between the computationally predicted results for a series of the shearing test by the different shaped bump and those due to experiment, has been proved, which indicates the capability of the proposed identification method for design of semiconductor packages.

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