Application of a Surface Reforming Systems Using High-Speed Plasma Treatment to the Next Generation Printed Wiring Board Circuit Formation Process

Details 詳細情報について

• CRID

  1520297427460348032

• ISSN

  27581683

• NDL BIB ID

  033027613

• Web Site

  http://id.ndl.go.jp/bib/033027613

  https://ndlsearch.ndl.go.jp/books/R000000004-I033027613

• Text Lang

  en

• NDL Source Classification

  • ZN11(科学技術--機械工学・工業)

• Data Source

  • NDL